Technology scaling along with unprecedented levels of device integration has led to increasing numbers of analog/mixed-signal/RF design bugs escaping into silicon. Such bugs are manifested under specific system-on-chip (SoC) operating conditions and …
The test generation problem for analog/RF circuits has been largely intractable due to the fact that repetitive circuit simulation for test stimulus optimization is extremely time-consuming. As a consequence, it is difficult, if not impossible, to …
In production testing of analog/RF ICs, application of standard specification-based tests for IC classification is not always an attractive option due to the high costs and test times involved. In this paper, a new test generation algorithm for IC …
As RF design scales to the 28nm technology node and beyond, pre-silicon simulation and verification of complex mixed-signal/RF SoCs is becoming intractable due to the difficulties associated with simulating diverse electrical effects and design bugs. …
With trends in mixed-signal systems-on-chip indicating increasingly extreme scaling of device dimensions and higher levels of integration, the tasks of both design and device validation is becoming increasingly complex. Post-silicon validation of …
Due to the use of scaled technologies, high levels of integration and high speeds of today's mixed-signal SoCs, the problem of validating correct operation of the SoC under electrical bugs and that of debugging yield loss due to unmodeled …